Job description

JOB TITLE: Mechanical Test Engineer
LOCATION: Sunnyvale, CA
DURATION: 6+ Months
Pay Range: $65-70/hr.

Job Description: We bring together world-class experts to develop and ship groundbreaking products at the intersection of hardware, software, and content. We build seemingly impossible products that define new categories that advance ***'s mission of connecting the world. This team has the responsibility for making breakthroughs and delivering them to market at scale. The Applied Materials team seeks a Thermomechanical Packaging Engineer with the ability to work on groundbreaking thermal solutions for AR and VR devices.

Thermo-Mechanical Characterization/test Engineer

Responsibilities
Understand thermal management systems in product roadmap and identify risks and opportunities.
Develop and qualify advanced thermal management solution-sets using Client technologies, either in-house or in collaboration with suppliers.
Determine performance KPIs - outline test plan and execution to hit design targets
Build test rigs to help qualify above solution-sets from CAD/concept to final set up
Characterize thermal, mechanical, and electrical properties of advanced thermal technologies for cooling consumer electronics.
Work with cross-functional partners, providing guidance, recommendations and next steps and manage work streams across different geographies
Identify process windows and seamlessly transition technology from development to high volume production.
Present regular updates on learnings and results to internal /external teams and bring to teams to consensus.

Minimum Qualifications
B.S. in Mechanical Engineering, Applied Physics or other relevant degree.
5+ years of experience with thermal characterization of hardware in a lab setting
Comfortable in a lab environment - proficient with hands-on lab work and logistics
Solid thermal background - experience with all modes of heat transfer
Good knowledge of heatsinks, graphites, TIMS, fan/blowers, and advanced thermal solutions
Thermal design of PCB and PCBA constituents
Good knowledge of IR, thermography, and in-situ thermal characterization
Familiar with metrology tools both in thermal and mechanical space in order to characterize various performance parameters, e.g., thermal conductivity, emissivity, air velocity, Wheatstone bridge (strain measurements), etc.
Excellent communications and presentation skills
Inquisitive and takes initiative - problem solver
Uses an analytical approach and drives projects to closure

Preferred Qualifications
M.S. in Mechanical Engineering, Applied Physics or other relevant discipline.
10+ years of experience with thermal characterization of hardware packaging, heat sinks and cooling solutions.
Good knowledge of CAD, fixture design, machine shop capabilities, and manufacturing processes
Familiarity with thermal software tools (Icepak, Flotherm)
Knowledge of JMP and MINITAB

IND123

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